Even the best engineering can be undermined by poor printed circuit board layout. The PCB layout services offered by Advantage Electronic Product Development directly address the physical design challenges in today’s high-performance electronic equipment. Did you know that in the past 6 years clock speeds have increased 7 fold, I/O count on IC packages 3 fold, PCB layer count and thermal density 2 fold? This is why more than ever, everyone on the team really must be expert. Expertise is king so the printed circuit board layout services we provide are designed to be a true collaborative effort between electrical, mechanical and layout engineers where each brings their expertise to bear.

Advantage recognizes the necessity of effective printed circuit board layout and has tailored services offered to address crucial factors that effect designs. Factors such as high speed rules, constraints; controlled impedance, matched lengths, crosstalk, Design For Manufacturability, Design For Test, EMC-EMI, thermal stress and mechanical considerations.

Services are performed by our trained printed circuit board layout engineers who have sound understanding of engineering concepts combined with expertise in pcb layout, so you receive an excellent layout the first time. The result is boards that speed their way through manufacturing, test, validation and ultimately to market with reduced development costs.

Layout practices can factually make or break the performance of high-speed designs that look good “on paper.” Careful attention to relevant details and forethought to the layout process helps to ensure the circuit performs as expected. See: High Speed Layout

Our high-speed printed circuit board layout services include detailed attention to the board layer stackup. A proper stackup plays a vital role in the success of a high-speed design. For example, different input and output signals should, wherever possible, be confined to well-defined layer allocations – digital outputs on layer X, clocks on layer Y, analog inputs on layer Z, etc. Once this is accomplished, we typically contain each layer type between solid ground plane layers. In general, signal integrity is best maintained utilizing multilayer boards with solid ground and power planes. We typically contain each layer type between solid ground plane layers as there are a number of benefits to ground planes, when properly used. Ground planes provide a common reference voltage, shielding and help reduce stray inductance (though they contribute to parasitic capacitance) as well as help to dissipate heat.

Critical considerations for high-speed layout such as component location are integral to Advantage’s printed circuit board layout services. Like a successful retail business, location is everything. Where will the circuit be placed on the board? How will the individual components within the circuit be placed? What other circuits will be in the general area? These are all questions that must be considered for a successful high speed layout. Even package type can have an influence – good or bad – on the final design. Bypassing at the power supply should be done at the circuit’s supply terminals to minimize noise. Placing different capacitor values in parallel will help ensure low AC impedance for the power supply pins across a wide band of frequencies.

Advantage’s high speed printed circuit board layout services expertise includes management of parasitics. Parasitics are stray capacitors and inductors that are hidden in the real world application of a design and can wreak havoc on an otherwise solid design. They include inductors formed by package leads and excess trace lengths; pad-to-ground, pad-to-power-plane, and pad-to-trace capacitors; interactions with vias, and many more possibilities. These must be considered and carefully planned around for a successful high speed layout.

Using analysis tools for modeling complex circuit board interactions such as signal integrity, characteristic impedance and cross-talk we use simulation as a tool to reduce risk in many areas. Our team includes a NARTE certified EMC Engineer and an SI Engineer that is an MSEE with 20 years of electronics design and a sole focus on signal integrity for the past 8 years.

SpectraQuest, Hyperlynx, HSPICE, ICX, PSPICE and Ansoft HFSS are used for board level simulation, signal integrity analysis, characteristic impedance and crosstalk depending upon the layout tool required and the level of detail needed. Also available are SSO / Resonance Digital PCB Power analysis, using Sigrity and board material & stack up simulation with Polar.

FPGA Logic Synthesis is another of the services we provide. See Embedded Design/Firmware

Rely on our printed circuit board layout proficiency and be more confident in your design.

• EMC/EMI Analysis
• SI Analysis
• Component Engineering (RoHS)
• Schematic Capture
• Footprint Library creation & maintenance
• Symbol Library creation & maintenance
• Manufacturing Level Documentation

Our printed circuit board layout services are performed under an ISO-9000 compliant quality assurance system. This means grooved-in procedures and fewer errors resulting in increased speed of process. Our large staff of proficient layout engineers and multiple CAD tools means that we can turn your design quickly and expertly with little or no queue time.

We will support the transition of your product to our manufacturing or yours. Full integrated documentation packages from design to manufacturing increase reliability and confidence with a seamless interface from prototype to production.